Titanium Forging Round Target

Titanium target is the product of high-purity titanium after processing and is made of thin film by physical vapor deposition. Used as a barrier layer for aluminum wires in semiconductor chips.

1. Main performance requirements of titanium target

(1) Appearance quality: Before leaving the factory, the titanium target should be cleaned without dust and the surface should be clean. After finishing the surface of the titanium target, the surface roughness should meet the requirements of customers.

(2) Internal defects: there should be no inclusions, pores, cracks and other defects inside the titanium target.

(3) Composition: The titanium target is divided into pure titanium target and alloy target, alloy target including titanium aluminum alloy target, titanium nitride target, titanium alloy boride target, etc. The purity of the target material is 99.9%-99.999%.

(4) Grain size: titanium target grains are uniform and fine, and the average grain is generally controlled to be less than 50μm.

(5) Texture: The crystal orientation of titanium target <002> is preferred, and ≥35%.

(6) Geometric size: the size of the titanium target varies according to the requirements of use, and the diameter is generally 200-460mm.

Titanium targets can be divided into single titanium targets and welded titanium targets according to their structure. The single titanium target does not need to be welded, and the billet processing is integrated. Welded titanium target is to weld the titanium target blank with the backplane, the common welding methods include brazing and diffusion welding. Welding backplane materials include copper and copper alloy backplane, aluminum and aluminum alloy backplane, etc. After welding, ultrasonic detection is made to ensure that the connection between the target and the backplane has a certain bonding strength to avoid problems such as falling off and cracking during sputtering. Table 9-23 describes the welding quality requirements for titanium targets.

2. Preparation of titanium target

The pure titanium target is generally prepared by the hot pressing process of smelting ingot. The titanium alloy target was prepared by powder metallurgy.

The hot pressing process is based on the high-purity titanium ingot obtained from melting. The microstructure and the shape and size of the billet are controlled by forging, rolling, annealing, and other plastic processing technology, and then the billet is machined to obtain the titanium target. After the forging, rolling, and annealing process, the titanium target has a fine and uniform grain and superior texture, which can meet the requirements of the titanium target in the sputtering process. The loss in the smelting ingot processing is large, including the loss in the melting casting process, the loss in the forging and rolling process because the oxide peel needs to be turned, and the loss in the cutting processing is also present, so the final utilization rate is about 80%.

For TiB2, TIAI, and other alloy targets, it is easy to crack during forging, and it is more suitable for powder metallurgy processing, that is, titanium powder and additives are used as raw materials, through the powder mixing process, and then the billet is processed with hot pressing or hot isostatic pressing force, and then the titanium alloy target is obtained. Powder metallurgy is the preferred method for preparing titanium alloy targets because it can form blank at one time, has a high material utilization rate, and can easily add alloying elements. The problems of powder metallurgy are the purity of the material, the uniformity of the alloy composition, and the density. Material internal defects and other aspects of the control requirements are high.

The working principle of titanium targets is related to a series of physical and chemical reactions and is widely used in physical vapor deposition (PVD), including magnetron sputtering, ion beam sputtering, and other methods. In these methods, titanium targets are a key raw material.

 

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